| Process Name |
Chemistry |
Application |
Process Tank |
Si Iso Etch |
HNO3+H2O+NH4F |
Etch Silicon |
PFA Teflon (near ambient)
Teflon Coated Stainless Steel
|
Oxide Etch
|
10:1 HF (H2O+49% HF) |
Etch Silicon Dioxide |
PFA Teflon with heat exchange coils |
Buffered Oxide Etch
|
5:1 (40% NH4F+49% HF) |
Silicon Dioxide |
PFA Teflon with heat exchange coils |
Quickdump Rinse
|
H2O |
chemical removal |
PVDF Quickdump |
Post Hot Phos Rinse
|
H2O |
Acid Rinse |
PVDF Quickdump Megasonic |
Post Piranha Rinse
|
H2O |
Acid rinse, Sulfate removal |
PVDF Quickdump Megasonic |
SC-2, HPM, RCA2, Huang B
|
HCL+H2O2+H2O |
Metals removal, alkalis and metal hydroxide removal |
Quartz recirculated Megasonic |
SC-1, APM,RCA1, Huang A
|
NH4OH+H202+H2O |
Particle removal, light organics removal, protective oxide regrowth |
Quartz recirculated Megasonic |
EDP
|
NH2(CH2)2NH2+C6H4(OH)+H20 |
Anisotropic Silicon Etch |
Quartz static or recirculated |
TMAH
|
TMAH |
Anisotropic Silicon Etch |
Quartz static or recirculated |
Cu FeCl3 200
|
Copper etchant type CE-200 from Transene (30% FeCl3 + 3-4% HCl + H2O) |
Etch Copper |
Quartz static or recirculated |
Cu APS 100
|
Copper etchant APS 100 from Transene (15-20% (NH4)2S2O8 + H2O) |
Etch Copper |
Quartz static or recirculated |
NiCr TFN
|
Nichrome etchant TFN from Transene (10-20% (NH4)2Ce(NO3)6) + 5-6% HNO3 + H2O) |
Etch NiCr |
Quartz static or recirculated |
Al Etch A
|
Al Etchant Type A from Transene (80% H3PO4 + 5% HNO3 + 5% HAc +10%H2O) |
Etch Aluminum |
Quartz static or recirculated |
CR-14
|
Chromium etchant CR-14 from Cyantek (22% (NH4) 2Ce(NO3)6) + 8% HAc+ H2O) |
Etch Chromium |
Quartz static or recirculated |
CR-7
|
Chromium etchant CR-7 from Cyantek (9% (NH 4)2Ce(NO3)6) + 6% HClO4 + H2O) |
Etch Chromium |
Quartz static or recirculated |
Aqua regia
|
HCl+HNO3 |
Etch Gold |
Quartz static or recirculated |
AU-5
|
Gold etchant AU-5 from Cyantek (5% I2 +10% KI + 85% H2O) |
Etch Gold |
Quartz static or recirculated |
Moly Etch
|
Molybdenum etchant (180 H3PO4 : 11 HAc : 11 HNO3 : 150 H2O) |
Etch Molybdenum |
Quartz static or recirculated |
Aqua regia, Dilute
|
Dilute aqua regia (3 HCl : 1 HNO3 : 2 H2O), ~30ºC |
Etch Noble metals |
Quartz static or recirculated |
Phos+Sulf
|
1 H2SO4 : 1 H3PO4 |
Etch Sapphire |
Quartz static or recirculated |
Pad Etch 4
|
Pad Etch 4 from Ashland (13% NH 4F + 32% HAc + 49% H2O + 6% propylene glycol + surfactant) |
Etch SiO2, not Al |
Quartz static or recirculated |
Ti Etch
|
Titanium wet etchant (20 H2O : 1 H2O2 : 1 HF) |
Etch Titanium |
Quartz static or recirculated |
H2O2 50ºC
|
Hydrogen peroxide (30wt% H2O2, 70wt% H2O) |
Etch Tungsten |
Quartz static or recirculated |
SA-80
|
(NH4)SO4+H2SO4 |
Organics removal |
Quartz static or recirculated |
SOM, Sulfuric/Ozone mix
|
H2SO4+O3 |
Organics removal |
Quartz static or recirculated |
DIO3, Ozinated water
|
DIH2O+O3 |
Organics removal, protective SiO2 regrowth |
Quartz static or recirculated |
Microstrip
|
Microstrip 2001 photoresist stripper, 85ºC |
Photoresist Strip |
Quartz static or recirculated |
Piranha, SPM
|
Piranha (~50 H2SO4 : 1 H2O2) |
Resist strip, Post-ash residue removal, organic removal |
Quartz static or recirculated |
Phosphoric
|
Phosphoric Acid (85% by weight) |
Etch Silicon nitride |
Quartz static or recirculated Dedicated Nitride Etch System |
Proprietary Solvent Resist Strippers
|
Various Solvents |
Remove Photoresist |
Quartz Static or recirculated
Stainless Steel (static or recirculated) |
IPA
|
Isopropanol |
Cleaning |
Stainless Steel static or recirculated |
Methanol
|
Methanol |
Cleaning |
Stainless Steel static or recirculated |
Acetone
|
Acetone |
Photoresist Strip |
Stainless Steel static or recirculated |
Anisotropic Etch
|
KOH (30% by weight) |
Anisotropic SiliconEtch |
Teflon Coated Stainless Steel |
